THEAMS

THERMALLY ENHANCED ADDITIVELY MANUFACTURED STRUCTURES-

Next-Level Thermal & Mechanical Management for Satellites

THEAMS - THERMALLY ENHANCED ADDITIVELY MANUFACTURED STRUCTURES- Next-Level Thermal & Mechanical Management for Satellites

Prevent overheating, maximize performance, and increase satellite revenue with Madrid Space’s innovative thermally enhanced solutions.

Problem Statement: Overheating is Limiting Your Satellite’s Performance

Flowchart showing that cooler equipment, increases performance and data processing capacity, generating more revenue with the same equipment

A Patented Solution for Advanced Satellite Thermal Management

THEAMS is the only solution that integrates advanced thermal control directly into your satellite equipment frame, enabling:

  • 15–30°C reduction in component temperature

  • 20–50% increase in power throughput & equipment value

  • 15–25% mass reduction

  • Enhanced vibration resilience under high-stress conditions

  • Reduced AIT (Assembly, Integration, and Test) effort

  • Extended equipment lifespan

Based on 2-phase fluid systems, additive manufacturing, and topology optimization, THEAMS reduces mass, volume, and costs, while improving reliability and revenue potential.

Applications: Ideal for a Wide Range of Satellite Systems

  • High-Power Antennae

  • Electronic Housings & PCBs

  • Laser Communication Terminals

  • Interferometers, Radar, Altimeters

  • Support Structures & Brackets for Optical/RF Detectors

  • Spacecraft Panels Hosting Electronics

Overheating is the leading cause of electronic failures in aerospace, affecting over 55% of satellite electronics (He, Yan & Zhang, 2021). Excessive temperatures slow down processors, reduce lifespan, and limit revenue potential. For every 2 °C increase in junction temperature (~80–90 °C), chip reliability drops by 10% (Lv et al., 2024).

Current solutions fail to extract heat efficiently at the chip or component level without costly additional integration steps. This is where THEAMS comes in.

Display of two temperature graphs for a printed circuit board (PCB). The graph on the left shows the temperature with areas in red and orange indicating high temperatures. The graph on the right shows the same PCB  with THEAMS

Thermal problems?

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